1. System in Package (SiP) :
SIP stands for System in Package. For easy integration into a system this type of technology is good. It was designed for multiple advanced packaging applications requiring a fully functional, highly specialized module. In SiP multiple integrated circuits enclosed in a single package or module.
The integrated circuits may be stacked vertically on a substrate and two or more ICs are bundled inside a single package. It performs most of the functions of an electronic system and it typically used inside smart phones, digital music player etc. It is considered as a functional package as it integrates multiple functional chips, including processors and memory, into a single package.
2. System on Chip (SoC) :
SoC stands for System on Chip. SoC is a less well defined term.It is a single chip which does everything that used to take up multiple chips. A SoC is an encapsulation of one or more of CPUs, micro-controllers, DSPs, other accelerators or supporting hardware and also more specifically it does not have a specific standard about what type of circuitry it should contain. It is intended for applications with more requirements and more complex. There might be a number of micro-controllers in a SoC.
It is more like a complete computer system on a single chip which capable to perform complex tasks which have higher resource requirement. It is sometimes abbreviated as SoC or SOC.
Difference between SiP and SoC :
|01.||SiP refers to encapsulation of one or more of CPUs, micro-controllers, DSPs, other accelerators and multi functional chips into a single package.||SoC refers to encapsulation of one or more of CPUs, micro-controllers, DSPs, other accelerators or supporting hardware into a single chip.|
|02.||Performance benefit is more in a System in Package.||Performance benefit is less in a System on Chip as compared to SiP.|
|03.||Product volume is more than SoC.||Product volume is less than SiP.|
|04.||It includes logic, memory and possibly analog or RF functions.||It includes a computer engine micro processor core, digital signal processor core or graphics core memory and logic on a single chip.|
|05.||Performance (Clock speed) is less than that of SoC.||Performance (Clock speed) is higher than that of SiP.|
|06.||SiP takes less time to market it.||SoC takes more time time to market it.|
|07.||System design flexibility of SiP is very high.||System design flexibility of SoC is very low.|
|08.||SiP has good IP availability chances.||SoC has not so good IP availability chances.|
|09.||Passive device integration is medium.||Passive device integration is small.|
|10.||It typically used inside smart phones, digital music player etc.||It typically used in mobile computing such as tablets, smartphones, smartwatches and netbooks as well as embedded systems.|
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