Tudip Technologies Interview Experience for Software Engineer

I applied to this company via a college placement

INTERVIEW PROCESS :

• First round:- Aptitude round
• Second round:- Technical round(Code)
• Third round:- Pen paper round
• Fourth round:- Technical round and HR (Final)

Aptitude Round:

• This round consists of 30 MCQ Questions
• 20 Aptitude or 10 Technical Questions
• Timing 30 min means per question 1 min

Note:

They circulate a Google form in which you must type your code not provide any ID or compiler to test whether your code is correct or not..!

Technical Round(Code):

• The second round is a coding round which consists of 3 questions
• If num > 41 then print foo if num>43 then print baar if num > 41 and num >43 print foobaar
• The third largest number from an array
• Print factorial program

Pen paper round:

• This round consists of 2 sets

Set 1:

• Find duplicate items in the string
• Find distinct character count from string example (abcdABCDabcd)

Set 2:

• Find whether the given array is palindrome or not
• Find duplicate items from the given array

Technical Round + Hr:

• Tell me about yourself
• Role in your Project
• Primary key vs foreign key
• Cube of 7
• 80 % of 70
• 200% of 100
• He saw a printer and assigned me a task to find the area of this printer
• Which technology would you choose if you get a chance to work with us frontend or backend
• Newton’s First, second, and third law
• Chemistry question:- si full form (Silica), o full form(Oxygen)
• Explain the questions which you write in pen paper round and provide me 2 more approach
• You win a first price in fireless cooking then tell me the recipe you make
• What is fireless cooking
• 625 square root
• Why should we hire you